Cooperation Agreement for Small Form-Factor Pluggable Transceivers

Agilent Technologies, Blaze Network Products, E2O Communications, Inc.,

ExceLight Communications, Finisar Corporation, Fujikura Technology America Corp., 

Hitachi Cable, Infineon Technologies Corp., IBM Corp., Lucent Technologies,

Molex, Inc., Optical Communication Products, Inc., Picolight, Inc.,

 Stratos Lightwave, Tyco Electronics

I.                   Purpose of the Cooperation Agreement (Agreement)

Each party desires to establish internationally compatible sources of a pluggable fiber optic transceiver module in support of standards for fiber optic systems including Asynchronous Transfer Mode (ATM), FDDI, Fibre Channel, Fast Ethernet and Gigabit Ethernet, and Synchronous Optical Network (SONET) / Synchronous Digital Hierarchy (SDH) applications.

Each party further desires to establish uniformity in the industry for the Transceiver “Package Dimensions”, “Cage and Electrical Connector System”, “Host Board Layout”, “Electrical Interfaces”, and “Front Panel Bezel Requirements” as described in Appendices A-B.

Each party expects that the establishment of compatible sources for an interchangeable transceiver module will allow the entire fiber optic marketplace to grow more rapidly.  This enhanced marketplace growth, customer choice, and vigorous competition are the express purposes of this Agreement.  Each party acknowledges this agreement provides a solution with height as a primary limiting constraint and may not provide an optimum solution for applications with different constraints. 

The parties desire to establish compatible sources for additional products in the future.

II.                 Agreement

A.        General

The parties agree to cooperate by supporting common product specifications for pluggable fiber optic transceivers with the package “Package Dimensions”, “Cage and Electrical Connector System”, “Host Board Layout”, “Electrical Interfaces”, and “Front Panel Bezel Requirements” as shown in Appendices A-B.  The overall package dimensions shall not exceed the maximum indicated dimensions, and the mounting features shall be located such that the products are mechanically interchangeable with the cage and connector system.  In addition the overall dimensions and mounting requirements for the cage and connector system on a circuit board shall be configured such that the products are mechanically and electrically interchangeable.

The electrical and optical specifications shall be compatible with those enumerated in the appropriate standards (i.e. the IEEE 802.3z Gigabit Ethernet standard and the ITU G.957 Synchronous Digital Hierarchy standard). Recommended circuit layouts for electrical input and output terminations, and grounding practices are also described in Appendix B.

The transceivers per this agreement will accept an optical connector such as the duplex LC, MT-RJ or the SG connector.  This agreement does not preclude any of the parties from offering SFP transceivers with other connectors.

Internal design of the SFP transceiver is entirely at the discretion of each party and is not covered by this Agreement.  The parties recognize that their products may not be identical, but need only meet the above criteria.


 

B.         Licensing and Fees

No license is granted under the patents, know-how, tradesecrets or any other technology of any party to this Agreement either expressly or by implication or by estoppel.   Each of the MSA parties have agreed that licenses to all required intellectual property will be made available to all interested parties under reasonable and non-discriminatory terms and conditions applicable to that MSA party.  Individual parties to this Agreement may have patents, which they believe may be relevant to this Agreement.  The MSA parties should be contacted individually to determine if they have patent rights, which they believe may be pertinent to this Agreement.  Each party is free to seek technology or other exchanges with other firms in order to support its activities under this Agreement.

C.        Scope of the Agreement

The scope of this Agreement includes transceivers with transmission rates up to 5.0 Gb/s operating over multimode and single mode fiber.

Each party agrees to be responsible for its own development, manufacturing, marketing and selling in order to supply transceivers meeting the attached specifications.

This Agreement does not preclude any party from offering other products that may not meet the attached specifications.

Each party retains complete liberty regarding its methods of implementing a supply of product, e.g., by engineering effort or by technology licensing or transfer or combination of these or other practices.

Each party also retains sole discretion in its choice of sales channels and distribution.

Each party affirms its intention to compete freely and openly in the marketplace with the parties as well as other competitors.

Each party expects to support products meeting the attached specifications for as long as marketplace conditions warrant.  No specific time limit is associated with this Agreement.  The determination of market condition suitability is to be made by each party individually and in each party’s sole discretion.

III.              Public Announcement   

A.        Announcing the Agreement

Each party agrees to announce this Agreement in a manner agreed upon by the parties.  These announcements will mention all the parties who have signed this Agreement.

Each party agrees to seek public attention by means of such an announcement.

Each party agrees to contribute time and effort at its sole discretion toward preparing and making such an announcement.


 

B.         Promotion of the Agreement

After the Agreement is announced, each party may advertise or otherwise promote this Agreement in any way that it deems appropriate.  Mutual consent of the other party is required if such other party is to be mentioned by name.

IV.             Other Vendors      

A.        Other Vendors Matching the Product Configuration

The parties recognize that additional vendors may choose to match the attached product specifications after this Agreement is announced.

Each party recognizes it is desirable and keeping with the intent of the Agreement for such additional vendors to support the transceiver mechanical dimensions and functional attributes described in Appendix A.

Therefore, each party agrees to encourage other vendors to support these product specifications.

B.         Naming Other Vendors

Each party agrees to have written internal procedures that require such party to name the other parties when customers ask who intends to be a source for transceivers as described in this Agreement.  Each party agrees for such procedures to require it to name the others regardless as to whether another of the parties has already supplied similar transceiver products to that customer.

An example of suggested wording is: “Agilent, Blaze Networks, E2O, ExceLight, Finisar, Fujikura, Hitachi Cable, Infineon, IBM, Lucent, Molex, OCP, Picolight, Stratos Lightwave, and Tyco have signed a Cooperation Agreement relating to the establishment of Small Form-factor Pluggable transceivers for multimode and single mode fiber operating up to 5.0 Gb/s data rates.”

The parties are not obligated to provide any information other than the identities of the other parties.  The requirements of this provision are met entirely if a party has the aforementioned written procedures and they are made available to its sales force in the same way as are other sales related procedures.

V.               Future Direction

A.      Current Product    

Should the parties agree to further explore technical and other exchanges pertaining to the products described in this Agreement, then this shall be under a separate agreement.

 


 

B.        Withdrawal

The parties recognize that at some future time it may become less feasible to offer the products envisioned by this Agreement.  A party may withdraw from its commitment to cooperate at its own discretion upon a 90-day notice to the other parties.   This notice is necessary to allow the other parties to discontinue mentioning the withdrawing part as a participant in this Agreement and to reconsider any jointly planned promotional activities.

VI.             Limitation of Liability

With the exception of disputes arising out of intellectual property issues, no party to this Agreement shall be liable for any indirect, incidental, punitive, or consequential damages, including without limitation, lost profits or changes of good will, or similar losses, even if advised of the possibility of such damages.  In addition, each party’s liability under this Agreement for direct damages shall be limited to $10,000.

 


 Appendix A.  Mechanical Interface

A1.  SFP Transceiver Package Dimensions

A2.  Mating of SFP Transceiver PCB to SFP Electrical Connector

A3.  Host Board Layout

A4.  Insertion, Extraction and Retention Forces for SFP Transceivers 

A5.  Labeling of SFP Transceivers

A6.  Bezel Design for Systems Using SFP Transceivers

A7.  SFP Electrical Connector Mechanical Specifications

A8.  SFP Cage Assembly Dimensions

Appendix B.  Electrical Interface

B1.  Introduction

B2.  Pin Definitions

B3.  Timing Requirements of Control and Status I/O

B4.  Module Definition Interface and Data Field Description

Appendix C.  Agreement Signatures


Appendix A. Mechanical Interface

A1.  SFP Transceiver Package Dimensions

A common mechanical outline is used for all SFP transceivers.  The package dimensions for the SFP transceiver are described in Table 1 and Figures 1A and 1B.

 

Table 1.  Dimension Table for Drawing of SFP Transceiver

 

Designator

Dimension

(mm)

Tolerance

(mm)

Comments

A

13.7

± 0.1

Transceiver width, nosepiece or front that extends inside cage

B

8.6

± 0.1

Transceiver height, front, that extends inside cage

C

8.5

± 0.1

Transceiver height, rear

D

13.4

± 0.1

Transceiver width, rear

E

1.0

Maximum

Extension of front sides outside of cage, see Note 2 Figure 1B

F

2.3

Reference

Location of cage grounding springs from centerline, top

G

4.2

Reference

Location of side cage grounding springs from top

H

2.0

Maximum

Width of cage grounding springs

J

28.5

Minimum

Location of transition between nose piece and rear of transceiver

K

56.5

Reference

Transceiver overall length

L

1.1x45°

Minimum

Chamfer on bottom of housing

M

2.0

± 0.25

Height of rear shoulder from transceiver printed circuit board

N

2.25

± 0.1

Location of printed circuit board to bottom of transceiver

P

1.0

± 0.1

Thickness of printed circuit board

Q

9.2

± 0.1

Width of printed circuit board

R

0.7

Maximum

Width of skirt in rear of transceiver

S

45.0

± 0.2

Length from latch shoulder to rear of transceiver

T

34.6

± 0.3

Length from latch shoulder to bottom opening of transceiver

U

41.8

± 0.15

Length from latch shoulder to end of printed circuit board

V

2.5

± 0.05

Length from latch shoulder to shoulder of transceiver outside of cage (location of positive stop).

W

1.7

± 0.1

Clearance for actuator tines

X

9.0

Reference

Transceiver length extending outside of cage, see Note 2 Figure 1B

Y

2.0

Maximum

Maximum length of top and bottom of transceiver extending outside of cage, see Note 2 Figure 1B

Z

0.45

± 0.05

Height of latch boss

AA

8.6

Reference

Transceiver height, front, that extends inside cage

AB

2.6

Maximum

Length of latch boss (design optional)

AC

45°

± 3°

Entry angle of actuator

AD

0.3

Maximum

Radius on entry angle of actuator

AE

6.3

Reference

Width of cavity that contains the actuator

AF

2.6

± 0.05

Width of latch boss (design optional)

AG

0.40

Minimum

Maximum radius of front of latch boss, 2 places (design optional)

 

Figure 1A.  Drawing of SFP Transceiver


 

 


 

 


Notes:

 

1.      Cage grounding springs permitted in this area and may extend full length of transceiver, 4 places. Grounding springs may contribute a maximum force of 3.5N (Newtons) to the withdrawal force of the transceiver from the cage.

 

2.      A representative MT-RJ configuration is illustrated. Indicated outline defines the preferred maximum envelope outside of the cage.

 

3.      Design of actuation method and shape is optional.

 

4.      Color code: An exposed colored feature of the transceiver (a feature or surface extending outside the cage assembly) shall be color coded as follows:

·         Black or beige for multi-mode

·         Blue for single mode

 


Figure 1B.  Drawing of SFP Transceiver (Cont.)

 


A2.  Mating of SFP Transceiver PCB to SFP Electrical Connector

The SFP transceiver contains a printed circuit board that mates with the SFP electrical connector. The pads are designed for a sequenced mating:

·        First mate – ground contacts

·        Second mate – power contacts

·        Third mate – signal contacts

The design of the mating portion of the transceiver printed circuit board is illustrated in Figure 2 and the electrical pad layout is illustrated in Figure 3. A typical contact pad plating for the printed circuit board is 0.38 micrometers minimum hard gold over 1.27 micrometers minimum thick nickel. Other plating options that meet the performance requirements are acceptable.

 

 


Figure 2.  Recommended Pattern Layout for SFP Printed Circuit Board


 


 

 

 

 

 

 


Figure 3.  SFP Transceiver Electrical Pad Layout

 

 

 

A3.  Host Board Layout

A typical host board mechanical layout for attaching the SFP Connector and Cage System is shown in Figures 4A and 4B.

 


 

Figure 4A.  SFP Host Board Mechanical Layout


Figure 4B.  SFP Host Board Mechanical Layout (Cont.)

 

A4.  Insertion, Extraction and Retention Forces for SFP Transceivers

The requirement for the various functional forces and the durability cycles are specified in Table 2.

 

Table 2.  Insertion, Extraction, and Retention Forces

 

Measurement

Minimum

Maximum

Units

Comments

SFP transceiver insertion

0

40

Newtons

 

SFP transceiver extraction

0

11.5

Newtons

 

SFP transceiver retention

90

170

Newtons

No damage to transceiver below 90N

Cage retention (Latch strength)

180

N/A

Newtons

No damage to latch below 180N

Cage kickout spring force

11.5

22

Newtons

 

Insertion / removal cycles, connector/cage

100

N/A

cycles

 

Insertion / removal cycles, SFP transceiver

50

N/A

cycles

 

 


A5.  Labeling of SFP Transceivers

Color coding requirements for optical SFP transceivers are specified in Figure 1B.

Each SFP transceiver should be clearly labeled. The complete labeling need not be visible when the SFP transceiver is installed.  Labeling should include appropriate manufacturing and part number identification, appropriate regulatory compliance labeling, and a clear specification of the external port characteristics.  The external port characteristic label may include such information as optical wavelength, required fiber characteristics, operating data rate, interface standards supported, and link length supported.

 

A6.  Bezel Design for Systems Using SFP Transceivers

Host enclosures that use SFP devices should provide appropriate clearances between the SFP transceivers to allow insertion and extraction without the use of special tools and a bezel enclosure with sufficient mechanical strength. For most systems a nominal centerline to centerline spacing of 16.25mm (0.640”) is sufficient. See Figure 5 for the recommended bezel design. For double-sided board mounting, a printed circuit board thickness of 3.0mm (0.118”) is required.

The SFP transceiver insertion slot should be clear of nearby moldings and covers that might block convenient access to the latching mechanisms, the SFP transceiver, or the cables connected to the SFP transceiver.

 

Figure 5.  Recommended Bezel Design


A7.  SFP Electrical Connector Mechanical Specifications

The SFP Connector is a 20-contact, right angle surface mount connector. It is described in Table 3 and Figure 6. The plating on the contacts is specified as follows:

·        Contact area: 0.38 micrometers minimum hard gold over 2.54 micrometers minimum thick nickel

·        Solder terminal area: gold flash or 2.54 micrometers tin lead plating over 2.54 minimum thick nickel.

 

 

Table 3.  SFP Transceiver Connector Dimensions

 

Designator

Dimension

(mm)

Tolerance

(mm)

Comments

A

9.4

± 0.08

Connector card slot width

B

1.4

± 0.05

Guide pin diameter

C

11.2

Maximum

Connector width

D

9.2

Maximum

Connector length

E

3.5

Reference

Distance from centerline of connector to outer contact

F

3.9

Reference

Distance from centerline of connector to outer contact

G

1.35

Maximum

Connector card slot height

H

2.6

Minimum

Height from bottom of connector to bottom of card slot

J

9.6

TP

Distance between guide pins

K

0.9

Reference

Diamond guide pin width

L

1.4

± 0.05

Diamond guide pin length

M

5.4

Maximum

Connector height

N

0.8

Reference

Length of solder leads past housing, front & rear

P

6.0

Minimum

Depth of card slot from front face of housing

Q

3.0

Maximum

Depth of contact point from front face of connector

R

0.7

± 0.1

Size of chamfer on top face of connector

S

0.3

Reference

Distance boss extends past front face of connector

T

1.0

Minimum

Size of chamfer at entry of card slot, all around

U

4.5

Reference

Length from centerline of guide posts to end of solder lead

 

 

 

Figure 6.  SFP Transceiver Connector Illustration


A8.  SFP Cage Assembly Dimensions 

The SFP Cage Assembly consists of two components: a lower cage that is soldered to the host board and a top cage that is assembled to the lower cage after soldering. A reference drawing describing the SFP Cage Assembly is provided in Table 4 and Figures 7A and 7B. The cage material is copper alloy and plating options are:

·                    Tin-lead plate 2.54 micrometers minimum over copper flash

·                    Tin plate 2.54 micrometers minimum over 0.76 micrometers minimum nickel

Table 4.  Dimension Table for Drawing of SFP Cage Assembly

Designator

Dimension

(mm)

Tolerance

(mm)

Comments

A

48.8

Maximum

Overall length

B

8.3

Maximum

Length from inside top of cage to latch

C

14.0

± 0.1

Inside width of cage

D

14.25

Basic

Distance between solderleg centerlines on side of cage

E

0.249

± 0.025

Thickness of solderleg

F

9.0

Basic

Distance between vent holes along length

G

11.8

Basic

Distance from front of cage to beginning of center vent hole row

H

7.9

Basic

Distance between vent holes across the width of the cage

J

2.0

± 0.1

Diameter of vent holes

K

16.5

Basic

Distance from front of cage to solderleg

L

10.0

Basic

Distance between chassis ground solderlegs along side

M

0.6

± 0.1

Width of EMI pins

N

0.7

± 0.1

Width of all chassis ground solderlegs

P

2.0

Maximum

Width of solderleg shoulder

Q

1.25

Maximum

Length of solderleg

R

3.95

Basic

Distance from centerline of cage to centerline of chassis ground solderleg

S

1.45

Basic

Distance from centerline of cage to centerline of chassis ground solderleg

T

1.45

Basic

Distance from centerline of cage to centerline of chassis ground solderleg

U

4.8

Basic

Distance from centerline of cage to centerline of EMI pins

V

0.5

± 0.05

Width of EMI pins on top cage

W

9.2

± 0.15

Distance from inside top of cage to inside bottom surface of front section of cage assembly

X

9.8

Maximum

Maximum height of cage assembly from host board

Z

10.0

Basic

Distance between chassis ground solderlegs along side

AA

11.5

Basic

Distance from front of cage to solderleg

AB

7.5

Minimum

Length of 9.2 (W) dimension from front of cage

AC

15.0

Maximum

Maximum width of cage assembly

AD

13.9

Minimum

Minimum width of inside of cage

AE

8.95

± 0.15

Height of inside of cage assembly

AF

1.0

Minimum

Height of clearance slots

AG

2.4

Basic

Distance of clearance slots from cage centerline


Table 4.  Dimension Table for Drawing of SFP Cage Assembly (Cont.)

 

Designator

Dimension

(mm)

Tolerance

(mm)

Comments

AH

3.0

± 0.1

Width of clearance slots

AJ

2.35

± 0.1

Distance from front of cage to latch opening

AK

2.8

± 0.1

Length of latch opening

AL

0.5

Minimum

Height of latch lead-in

AM

45.6

Maximum

Distance from front of cage to kickout spring

AN

35.0

Maximum

Distance from front of cage to end of cage floor

AP

0.7

± 0.1

Width of solderlegs that extend from floor of cage

AQ

5.1

Maximum

Width of latch

AR

3.0

± 0.05

Width of latch opening

AS

16.3

Basic

Front of cage to beginning of outer vent hole rows

AT

0.65

Maximum

Inside radius of cage, four places

AU

5.8

Minimum

Distance between panel ground spring supports

AV

12.7

Maximum recommended

Length of plug extending outside of the cage

AW

15.75

Maximum

Width of plug extending outside of the cage

AX

10.9

Maximum

Height of plug extending outside of the cage

 

A9.          Dust / EMI Cover

The order to prevent contamination of the internal components and to optimize EMI performance, it is recommended that a Dust/EMI Plug be inserted into cage assemblies when no transceiver is present.  The maximum dimensions of the Dust/EMI Cover are listed in Table 4 and the maximum size is illustrated in Figure 7A.  The Dust/EMI Cover shall exert a maximum force of 4.0 Newtons per side to the inside surfaces of the cage.  This force shall be measured as the force/side required to compress the Dust/EMI Cover’s compliant feature(s) to the maximum dimensions listed in Table 4 (Illustrated in Figure 7A).

 

Figure 7A.  SFP Cage Assembly


 

 

Figure 7B.  SFP Cage Assembly (Cont.)


Appendix B. Electrical Interface

B1.         Introduction

This annex contains pin definition data for the small form-factor pluggable (SFP) transceiver. The pin definition data is specific to gigabit rate datacom applications such as Fibre Channel and Gigabit Ethernet.  It is expected that different pin definitions will be developed for SONET/ATM and lower data rate datacom applications.

 

B2.         Pin Definitions

Figure 1 below shows the pin names and numbering for the connector block on the host board.  The diagram is in the same relative orientation as the host board layout (see Appendix A, Figure 4.).  As mentioned, this pinout only applies to gigabit rate datacom applications.  The pin functions are defined in Table 1 and the accompanying notes.  Figure 2A shows the recommended power supply filtering network.  Figure 2B shows an example of a complete SFP host board schematic with connections to SerDes and protocol ICs.  For EMI protection the signals to the 20-pin connector should be shut off when the transceiver is removed.  Standard board layout practices such as connections to Vcc and GND with Vias, use of short- and equal-length differential signal lines, use of microstrip-lines and 50W terminations are recommended.  Chassis grounds and external electromagnetic interference shields should not be attached to circuit ground.

 

 

 

Figure 1.  Diagram of Host Board Connector Block Pin Numbers and Names


 

Table 1. Pin Function Definitions

Pin Num.

 

Name

 

Function

Plug

Seq.

 

Notes

1

VeeT

Transmitter Ground

1

 

2

TX Fault

Transmitter Fault Indication

3

Note 1

3

TX Disable

Transmitter Disable

3

Note 2
Module disables on high or open

4

MOD-DEF2

Module Definition 2

3

Note 3, 2 wire serial ID interface

5

MOD-DEF1

Module Definition 1

3

Note 3, 2 wire serial ID interface

6

MOD-DEF0

Module Definition 0

3

Note 3, Grounded in Module

7

Rate Select

Select between full or reduced
receiver bandwidth

3

Note 4
Low or Open – reduced bandwidth,
High– full bandwidth

8

LOS

Loss of Signal

3

Note 5

9

VeeR

Receiver Ground

1

Note 6

10

VeeR

Receiver Ground

1

Note 6

11

VeeR

Receiver Ground

1

Note 6

12

RD-

Inv. Received Data Out

3

Note 7

13

RD+

Received Data Out

3

Note 7

14

VeeR

Receiver Ground

1

Note 6

15

VccR

Receiver Power

2

3.3  ± 5%, Note 8

16

VccT

Transmitter Power

2

3.3  ± 5%, Note 8

17

VeeT

Transmitter Ground

1

Note 6

18

TD+

Transmit Data In

3

Note 9

19

TD-

Inv. Transmit Data In

3

Note 9

20

VeeT

Transmitter Ground

1

Note 6

Plug Seq.: Pin engagement sequence during hot plugging.

1)     TX Fault is an open collector/drain output, which should be pulled up with a 4.7K – 10KW resistor on the host board.  Pull up voltage between 2.0V and VccT, R+0.3V.  When high, output indicates a laser fault of some kind.  Low indicates normal operation. In the low state, the output will be pulled to < 0.8V.           

2)     TX disable is an input that is used to shut down the transmitter optical output.  It is pulled up within the module with a 4.7 – 10 KW  resistor.  Its states are:  

 

Low (0 – 0.8V):                Transmitter on          
(>0.8, < 2.0V):                 Undefined     
High (2.0 – 3.465V):       Transmitter Disabled           
Open:                                Transmitter Disabled           


Table 1 Notes (Cont.)

3)     Mod-Def 0,1,2.  These are the module definition pins.  They should be pulled up with a 4.7K – 10KW resistor on the host board. The pull-up voltage shall be VccT or VccR (see Section IV for further details).                                  

Mod-Def 0 is grounded by the module to indicate that the module is present        
Mod-Def 1 is the clock line of two wire serial interface for serial ID 
Mod-Def 2 is the data line of two wire serial interface for serial ID  

4)     This is an optional input used to control the receiver bandwidth for compatibility with multiple data rates (most likely Fibre Channel 1x and 2x Rates).  If implemented, the input will be internally pulled down with > 30kW resistor. The input states are:    

Low (0 – 0.8V):                Reduced Bandwidth
(>0.8 , < 2.0V):                Undefined     
High (2.0 – 3.465V):       Full Bandwidth          
Open:                                Reduced Bandwidth            

 

5)     LOS (Loss of Signal) is an open collector/drain output, which should be pulled up with a 4.7K – 10KW resistor. Pull up voltage between 2.0V and VccT, R+0.3V.  When high, this output indicates the received optical power is below the worst-case receiver sensitivity (as defined by the standard in use).  Low indicates normal operation. In the low state, the output will be pulled to < 0.8V.

 

6)     VeeR and VeeT may be internally connected within the SFP module.        

7)     RD-/+: These are the differential receiver outputs.  They are AC coupled 100 W differential lines which should be terminated with 100 W (differential) at the user SERDES.  The AC coupling is done inside the module and is thus not required on the host board.  The voltage swing on these lines will be between 370 and 2000 mV differential (185 – 1000 mV single ended) when properly terminated.       

8)     VccR and VccT are the receiver and transmitter power supplies.  They are defined as 3.3V ±5% at the SFP connector pin.  Maximum supply current is 300 mA.  Recommended host board power supply filtering is shown below. Inductors with DC resistance of less than 1W should be used in order to maintain the required voltage at the SFP input pin with 3.3V supply voltage.  When the recommended supply filtering network is used, hot plugging of the SFP transceiver module will result in an inrush current of no more than 30 mA greater than the steady state value.  VccR and VccT may be internally connected within the SFP transceiver module.    

9)     TD-/+: These are the differential transmitter inputs.  They are AC-coupled, differential lines with 100W differential termination inside the module. The AC coupling is done inside the module and is thus not required on the host board.  The inputs will accept differential swings of 500 – 2400 mV (250 – 1200 mV single-ended), though it is recommended that values between 500 and 1200 mV differential (250 – 600 mV single-ended) be used for best EMI performance.

 

                                        

 

 

Figure 2A.  Recommended Host Board Supply Filtering Network

 

Figure 2B.  Example SFP Host Board Schematic


B3.         Timing Requirements of Control and Status I/O


The timing requirements of the control and status lines are drawn largely from the GBIC standard at the time of writing.  They are summarized in Table 2 below:

 

Table 2. Timing Requirements of Control and Status I/0

Parameter

Symbol

Min

Max

Unit

Condition

TX Disable Assert Time

 

t_off

 

 

10

 

ms

Time from rising edge of TX Disable to when the optical output falls below 10% of nominal

TX Disable Negate Time

 

t_on

 

 

1

 

ms

Time from falling edge of TX Disable to when the modulated optical output rises above 90% of nominal

Time to initialize, including reset of TX_Fault

 

t_init

 

 

300

 

ms

From power on or negation of TX Fault using TX Disable

TX Fault Assert Time

t_fault

 

100

ms

Time from fault to TX fault on.

TX Disable to reset

t_reset

10

 

ms

Time TX Disable must be held high to reset TX_fault

LOS Assert Time

t_loss_on

 

100

ms

Time from LOS state to RX LOS assert

LOS Deassert Time

t_loss_off

 

100

ms

Time from non-LOS state to RX LOS deassert

Rate-Select Change Time

t_ratesel

 

10

ms

Time from rising or falling edge of Rate Select input until receiver bandwidth is in conformance with appropriate specification.

Serial ID Clock Rate

f_serial_clock

 

100

kHz

 

 

 

SFP transceiver power on initialization procedure, TX_DISABLE negated.During power on of the SFP transceiver, TX_FAULT, if implemented, may be asserted (High) as soon as power supply voltages are within specification. For transceiver initialization with TX_DISABLE negated, TX_FAULT shall be negated when the transmitter safety circuitry, if implemented, has detected that the transmitter is operating in its normal state. If a transmitter fault has not occurred, TX_FAULT shall be negated within a period t_init from the time that VCCT exceeds the specified minimum operating voltage (see Table 2). If TX_FAULT remains asserted beyond the period t_init, the host may assume that a transmission fault has been detected by the transceiver.
 SFP transceiver power on initialization procedure, TX_DISABLE negated (Cont.)

If no transmitter safety circuitry is implemented, the TX_FAULT signal may be tied to its negated state.

The power-on initialization timing for a transceiver with TX_DISABLE negated is shown in Figure 3.

 

Figure 3.  Power on initialization of SFP transceiver, TX_DISABLE negated

 

SFP transceiver power on initialization procedure, TX_DISABLE asserted.

For SFP transceiver power on initialization with TX_DISABLE asserted, the state of TX_FAULT is not defined while TX_DISABLE is asserted. After TX_DISABLE is negated, TX_FAULT may be asserted while safety circuit initialization is performed. TX_FAULT shall be negated when the transmitter safety circuitry, if implemented, has detected that the transmitter is operating in its normal state. If a transmitter fault has not occurred, TX_FAULT shall be negated within a period t_init from the time that TX_DISABLE is negated. If TX_FAULT remains asserted beyond the period t_init, the host may assume that a transmission fault has been detected by the transceiver.

If no transmitter safety circuitry is implemented, the TX_FAULT signal may be tied to its negated state.  The power-on initialization timing for a SFP transceiver with TX_DISABLE asserted is shown in Figure 4.


 

Figure 4.  Power on initialization of SFP, TX_DISABLE asserted

Initialization during hot plugging of SFP TRANSCEIVER.When a transceiver is not installed, TX_FAULT is held to the asserted state by the pull up circuits on the host. As the SFP transceiver is installed, contact is made with the ground, voltage, and signal contacts in the specified order. After the SFP has determined that VCCT has reached the specified value, the power on initialization takes place as described in the above sections. An example of initialization during hot plugging is provided in Figure 5.

 

Figure 5.  Example of initialization during hot plugging,

TX_DISABLE negated.

SFP transmitter management

The timing requirements for the management of optical outputs from the SFP transceiver using the TX_DISABLE signal are shown in Figure 6.  Note that the t on time refers to the maximum delay until the modulated optical signal reaches 90% of the final value, not just the average optical power.
 Figure 6.  SFP TX_DISABLE timing during normal operation.

 

SFP transceiver fault detection and presentation

TX_FAULT shall be implemented by those module definitions of SFP transceiver supporting safety circuitry. If TX_FAULT is not implemented, the signal shall be held to the low state by the SFP transceiver.

Figure 7.  Detection of transmitter safety fault condition

 

SFP transceiver fault recovery

The detection of a safety-related transmitter fault condition presented by TX_FAULT shall be latched. The following protocol may be used to reset the latch in case the transmitter fault condition is transient. To reset the fault condition and associated detection circuitry, TX_DISABLE shall be asserted for a minimum of t_reset. TX_DISABLE shall then be negated. In less than the maximum value of t_init the optical transmitter will correctly reinitialize the laser circuits, negate TX_FAULT, and begin normal operation if the fault condition is no longer present. If a fault condition is detected during the reinitialization, TX_FAULT shall again be asserted, the fault condition again latched, and the optical transmitter circuitry will again be disabled until the next time a reset protocol is attempted. The manufacturer of the SFP shall ensure that the optical power emitted from an open connector or fiber is compliant with IEC825-1 and CDRH during all reset attempts, during normal operation or upon the occurrence


SFP transceiver fault recovery (Cont.)

of reasonable single fault conditions. The SFP transceiver may require internal protective circuitry to prevent the frequent assertion of the TX_DISABLE signal from generating frequent pulses of energy that violate the safety requirements. The timing for successful recovery from a transient safety fault condition is shown in Figure 8.

Figure 8.  Successful recovery from transient safety fault conditionAn example of an unsuccessful recovery, where the fault condition was not transient, is shown in Figure 9.

Figure 9.  Unsuccessful recovery from safety fault condition

 


SFP transceiver loss of signal indication

The LOS signal is intended as a preliminary indication to the system in which the SFP transceiver is installed that the link signals are likely to be outside the required values for proper operation. Such indications typically point to non-installed cables, broken cables, or a disabled, failing or powered off transmitter at the far end of the cable. Additional indications are provided by the system in which the SFP transceiver is installed to verify that the information being transmitted is valid, correctly encoded, and in the correct format. Such additional indications are outside the scope of the SFP TRANSCEIVER MSA.

The timing of the LOS function is specified in Figure 10.

Figure 10.  Timing of LOS detection

B4.         Module Definition Interface and Data Field Description


The definition of the MOD-DEF function is drawn largely from the GBIC standard with some small, but backwards compatible, changes to the fields or allowed values to reflect the latest standards and expectations for these transceivers.  In some cases, this backward compatibility approach results in the possibility of illegal combinations (such as defining an SFP module with SC optical connectors).  Some locations previously reserved in the GBIC serial identification have now been defined. 

 

It should be noted that only the serial module definition and the basic Mod-Def 0 indication of module present are implemented.  The use of MOD DEF lines as static codes for module definition as done with GBIC are not implemented.

Overview

The SFP serial ID provides access to sophisticated identification information that describes the transceiver’s capabilities, standard interfaces, manufacturer, and other information. The serial interface uses the 2-wire serial CMOS E2PROM protocol defined for the ATMEL AT24C01A/02/04 family of components. When the serial protocol is activated, the host generates the serial clock signal (SCL, Mod Def 1).  The positive edge clocks data into those segments of the E2PROM that are not write-protected within the SFP transceiver.  The negative edge clocks data from the SFP transceiver.The serial data signal (SDA, Mod Def 2) is bi-directional for serial data transfer. The host uses SDA in conjunction with SCL to mark the start and end of serial protocol activation. The memories are organized as a series of 8-bit data words that can be addressed individually or sequentially.

This section defines the information structures that are obtained from the SFP transceiver via the serial ID.

A SFP transceiver shall meet the electrical and optical requirements, including amplitude, eye diagram, jitter, and other parameters, specified for the standards with which the transceiver claims compliance.

Serial information definition

The 2-wire serial CMOS E2PROM provides sequential or random access to 8 bit parameters, addressed from 0000h to the maximum address of the memory. The address select pins for the serial CMOS E2PROM shall be set to zero (fixed at the VIL low level). The fields specified by this section shall not be written by the host in which it is installed. The SFP transceiver may enforce this by using the write protect features of the CMOS E2PROM.
 

Serial information definition (Cont.)

The word address is transmitted with the high order bit transmitted first. The protocol for the 2-wire serial interface sequentially transmits one or more 8-bit bytes, with the data byte addressed by the lowest word address transmitted first. In each data byte, the high order bit (bit 7 in the accompanying tables) is transmitted first.

Numeric fields are expressed in binary, with the high order byte being transferred first and the high order bit of each byte being transferred first. Numeric fields are padded on the left with binary zero values.

Character strings are ordered with the first character to be displayed located in the lowest word address of the string. Each character shall be coded as a US-ASCII character as defined by ISO 8859-1, with the high order bit transmitted first. All character strings will be padded on the right with ASCII spaces (20h) to fill empty bytes.

All bits of reserved fields shall be set to zero until future definitions require their use.

A minimum of 96 bytes shall be readable by the serial identification process.

The maximum clock rate of the serial interface shall be 100 KHz.

The following tables define the contents of the serial CMOS E2PROM. The first table is a summary of all the data fields in the serial ID chip. The remaining tables contain detailed descriptions of the individual data fields.
Table 3.1.  Serial ID: Data Fields

 

Data Address

Field Size (Bytes)

 

Name of

field

 

Description of field

 

 

BASE ID FIELDS

0

1

Identifier

Type of serial transceiver (see Table 3.2)

 

1

1

Ext. Identifier

Extended identifier of type of serial transceiver

 

2

1

Connector

Code for connector type (see Table 3.3)

 

3-10

8

Transceiver

Code for electronic compatibility or optical compatibility

(see Table 3.4)

 

11

1

Encoding

Code for serial encoding algorithm (see Table 3.5)

 

12

1

BR, Nominal

Nominal bit rate, units of 100 MBits/sec.

 

13

1

Reserved  

 

14

1

Length(9m) - km

Link length supported for 9/125 mm fiber, units of km

 

15

1

Length (9m)

Link length supported for 9/125 mm fiber, units of 100 m

 

16

1

Length (50m)

Link length supported for 50/125 mm fiber, units of 10 m

 

17

1

Length (62.5m)

Link length supported for 62.5/125 mm fiber, units of 10 m

 

18

1

Length (Copper)

Link length supported for copper, units of meters

 

19

1

Reserved

 

 

20-35

16

Vendor name

SFP transceiver vendor name (ASCII)

 

36

1

Reserved

 

 

37-39

3

Vendor OUI

SFP transceiver vendor IEEE company ID

 

40-55

16

Vendor PN

Part number provided by SFP transceiver vendor (ASCII)

 

56-59

4

Vendor rev

Revision level for part number provided by vendor (ASCII)

 

60-62

3

Reserved

 

 

63

1

CC_BASE

Check code for Base ID Fields (addresses 0 to 62)

 

EXTENDED ID FIELDS

 

64-65

2

Options

Indicates which optional SFP signals are implemented
(see Table 3.6)

 

66

1

 BR, max

Upper bit rate margin, units of %

 

67

1

BR, min

Lower bit rate margin, units of %

 

68-83

16

Vendor SN

Serial number provided by vendor (ASCII)

 

84-91

8

Date code

Vendor’s manufacturing date code (see Table 3.7)

 

92-94

3

Reserved

 

 

95

1

CC_EXT

Check code for the Extended ID Fields (addresses 64 to 94)

 

 

VENDOR SPECIFIC ID FIELDS

 

96-127

32

Read-only

Vendor specific data, read only

 

128-511

384

Reserved

 

 

512-n

 

 

Vendor specific

 

 

Identifier 

The identifier value specifies the physical device described by the serial information. This value shall be included in the serial data. The defined identifier values are shown in Table 3.2.

Table 3.2.  Identifier Values

Value

Description of Physical Device

00h

Unknown or unspecified

01h

GBIC

02h

Module/connector soldered to motherboard

03h

SFP transceiver

04-7Fh

Reserved

80-FFh

Vendor specific

 

Extended Identifier

The field should be set to 04h for all SFP modules indicating serial ID module definition.

ConnectorThe Connector value indicates the external connector provided on the interface. This value shall be included in the serial data. The defined connector values are shown in Table 3.3. Note that 01h – 05h are not SFP compatible, and are included for compatibility with GBIC standards

TABLE 3.3.  Connector Values

Value

Description of Connector

00h

Unknown or unspecified

01h

SC

02h

Fibre Channel Style 1 copper connector

03h

Fibre Channel Style 2 copper connector

04h

BNC/TNC

05h

Fibre Channel coaxial headers

06h

FiberJack

07h

LC

08h

MT-RJ

09h

MU

0Ah

SG

0Bh

Optical pigtail

0C-1Fh

Reserved

20h

HSSDC II

21h

Copper Pigtail

22h-7Fh

Reserved

80-FFh

Vendor specific

 

Transceiver

The following bit significant indicators define the electronic or optical interfaces that are supported by the SFP transceiver. At least one bit shall be set in this field. For Fibre Channel SFPs, the Fibre Channel speed, transmission media, transmitter technology, and distance capability shall all be indicated.

Table 3.4.  Transceiver codes

 

Data
Addr

Bit[1]

Description of transceiver

Data Addr

Bit1

Description of transceiver

Reserved Standard Compliance Codes

Fibre Channel link length

3

7-0

Reserved

7

7

very long distance (V)

4

7-4

Reserved

7

6

short distance (S)

SONET Compliance Codes

7

5

intermediate distance (I)

4

3

Reserved

7

4

long distance (L)

4

2

OC 48, long reach

Fibre Channel transmitter technology

4

1

OC 48, intermediate reach

7

3-2

Reserved

4

0

OC 48 short reach

7

1

Longwave laser (LC)

5

7

Reserved

7

0

Electrical inter-enclosure (EL)

5

6

OC 12, single mode long reach

8

7

Electrical intra-enclosure (EL)

5

5

OC 12, single mode inter. reach

8

6

Shortwave laser w/o OFC (SN)

5

4

OC 12 multi-mode short reach

8

5

Shortwave laser w/ OFC (SL)

5

3

Reserved

8

4

Longwave laser (LL)

5

2

OC 3, single mode long reach

8

0-3

Reserved

5

1

OC 3, single mode inter. reach

 

 

 

5

0

OC 3, multi-mode short reach

Fibre Channel transmission media

 

 

 

9

7

Twin Axial Pair (TW)

 

 

 

9

6

Shielded Twisted Pair (TP)

 

 

 

9

5

Miniature Coax (MI)

Gigabit Ethernet Compliance Codes

9

4

Video Coax (TV)

6

7-4

Reserved

9

3

Multi-mode, 62.5m (M6)

6

3

1000BASE-T

9

2

Multi-mode, 50 m (M5)

6

2

1000BASE-CX

9

1

Reserved

6

1

1000BASE-LX

9

0

Single Mode (SM)

6

0

1000BASE-SX

 

 

 

 

 

 

Fibre Channel speed

 

 

 

10

7-5

Reserved

 

 

 

10

4

400 MBytes/Sec

 

 

 

10

3

Reserved

 

 

 

10

2

200 MBytes./Sec

 

 

 

10

1

Reserved

 

 

 

10

0

100 MBytes/Sec

 

Encoding

The encoding value indicates the serial encoding mechanism that is the nominal design target of the particular SFP transceiver. The value shall be contained in the serial data. The defined encoding values are shown in Table 3.5.

Table 3.5.  Encoding codes

 

code

Description of encoding mechanism

00h

Unspecified

01h

8B10B

02h

4B5B

03h

NRZ

04h

Manchester

05h -FFh

Reserved

 

BR, nominal

The nominal bit rate (BR, nominal) is specified in units of 100 Megabits per second, rounded off to the nearest 100 Megabits per second. The bit rate includes those bits necessary to encode and delimit the signal as well as those bits carrying data information. A value of 0 indicates that the bit rate is not specified and must be determined from the transceiver technology. The actual information transfer rate will depend on the encoding of the data, as defined by the encoding value.

Length (9m)-km

Addition to EEPROM data from original GBIC definition. This value specifies the link length that is supported by the SFP transceiver while operating in compliance with the applicable standards using single mode fiber. The value is in units of kilometers. A value of 255 means that the transceiver supports a link length greater than 254 km. A value of zero means that the transceiver does not support single mode fiber or that the length information must be determined from the transceiver technology.

Length (9m)

This value specifies the link length that is supported by the SFP transceiver while operating in compliance with the applicable standards using single mode fiber. The value is in units of 100 meters. A value of 255 means that the transceiver supports a link length greater than 25.4 km. A value of zero means that the SFP transceiver does not support single mode fiber or that the length information must be determined from the transceiver technology.


Length (50m) 

This value specifies the link length that is supported by the SFP transceiver while operating in compliance with the applicable standards using 50 micron multi-mode fiber. The value is in units of 10 meters. A value of 255 means that the SFP transceiver supports a link length greater than 2.54 km. A value of zero means that the transceiver does not support 50 micron multi-mode fiber or that the length information must be determined from the transceiver technology.

Length (62.5m)

This value specifies the link length that is supported by the SFP transceiver while operating in compliance with the applicable standards using 62.5 micron multi-mode fiber. The value is in units of 10 meters. A value of 255 means that the SFP transceiver supports a link length greater than 2.54 km. A value of zero means that the SFP transceiver does not 62.5 micron multi-mode fiber or that the length information must determined from the transceiver technology. It is common for the SFP transceiver to support both 50 micron and 62.5 micron fiber.

Length (Copper)

This value specifies the minimum link length that is supported by the SFP transceiver while operating in compliance with the applicable standards using copper cable. The value is in units of 1 meter. A value of 255 means that the SFP transceiver supports a link length greater than 254 meters. A value of zero means that the SFP transceiver does not support copper cables or that the length information must be determined from the transceiver technology. Further information about the cable design, equalization, and connectors is usually required to guarantee meeting a particular length requirement.

Vendor name

The vendor name is a 16 character field that contains ASCII characters, left-aligned and padded on the right with ASCII spaces (20h). The vendor name shall be the full name of the corporation, a commonly accepted abbreviation of the name of the corporation, the SCSI company code for the corporation, or the stock exchange code for the corporation. At least one of the vendor name or the vendor OUI fields shall contain valid serial data.

Vendor OUI

The vendor organizationally unique identifier field (vendor OUI) is a 3-byte field that contains the IEEE Company Identifier for the vendor. A value of all zero in the 3-byte field indicates that the Vendor OUI is unspecified.

Vendor PN

The vendor part number (vendor PN) is a 16-byte field that contains ASCII characters, left-aligned and padded on the right with ASCII spaces (20h), defining the vendor part number or product name. A value of all zero in the 16-byte field indicates that the vendor PN is unspecified.


Vendor Rev

The vendor revision number (vendor rev) is a 4-byte field that contains ASCII characters, left-aligned and padded on the right with ASCII spaces (20h), defining the vendor’s product revision number. A value of all zero in the 4-byte field indicates that the vendor Rev is unspecified.

CC_BASE

The check code is a one byte code that can be used to verify that the first 64 bytes of serial information in the SFP transceiver is valid. The check code shall be the low order 8 bits of the sum of the contents of all the bytes from byte 0 to byte 62, inclusive.

Options

The bits in the option field shall specify the options implemented in the SFP transceiver as described in Table 3.6.

Table 3.6.  Option Values

data
address

bit

Description of option

64

7-0

Reserved

65

7-6

Reserved

65

5

RATE_SELECT is implemented

If bit is set then active control of the rate select pin is required to change rates.  If bit is not set, no control of pin is required.  In all cases, compliance with multiple rate standards should be determined by Transceiver Codes in Bytes 4, 5, 6 and 10.  (See Table 3.4)

65

4

TX_DISABLE is implemented and disables the serial output.

65

3

TX_FAULT signal implemented. (Reset defined in section III)

65

2

Loss of Signal implemented, signal inverted from definition in Table 1

NOTE: This is not standard SFP transceiver behavior and should be avoided, since non-interoperable behavior results.

65

1

Loss of Signal implemented, signal as defined in Table 1

65

0

Reserved

BR, max

The upper bit rate limit at which the SFP transceiver will still meet its specifications (BR, max) is specified in units of 1% above the nominal bit rate. A value of zero indicates that this field is not specified.

BR, min

The lower bit rate limit at which the SFP transceiver will still meet its specifications (BR, min) is specified in units of 1% below the nominal bit rate. A value of zero indicates that this field is not specified.


Vendor SN

The vendor serial number (vendor SN) is a 16 character field that contains ASCII characters, left-aligned and padded on the right with ASCII spaces (20h), defining the vendor’s serial number for the SFP transceiver. A value of all zero in the 16-byte field indicates that the vendor SN is unspecified.

Date Code

The date code is an 8-byte field that contains the vendor’s date code in ASCII characters. The date code is mandatory. The date code shall be in the format specified by Table 3.7.

 

Table 3.7.  Date Code

 

Data Address

Description of field

84-85

ASCII code, two low order digits of year. (00 = 2000).

86-87

ASCII code, digits of month (01 = Jan through 12 = Dec)

88-89

ASCII code, day of month (01 - 31)

90-91

ASCII code, vendor specific lot code, may be blank

 

CC_EXT

The check code is a one byte code that can be used to verify that the first 32 bytes of extended serial information in the SFP transceiver is valid. The check code shall be the low order 8 bits of the sum of the contents of all the bytes from byte 64 to byte 94, inclusive.

Read-only

This area may contain vendor specific information which can be read from the SFP transceiver. The data is read only.


Appendix C. Agreement Signatures

A.        For Agilent Technologies by:                                                                                                        

 

 

 

 

 

 

 

 

 

 

 

 

 

 

_________________________________

Signed

 

Shane Gibeson_____________________

Name

 

Business Unit Manager_______________

Title

 

_________________________________

Date


 

B.        For Blaze Network Products by:                                                                                                    

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

_________________________________

Signed

 

Kirk Bovill_________________________

Name

 

Director of Product Marketing__________

Title

 

_________________________________

Date

 


 

C.        For E2O Communications, Inc. by:                                                                                              

 

 

 

 

 

 

 

 

 

 

 

 

 

 

_________________________________

Signed

 

H. C. Lee__________________________

Name

 

President and CEO__________________

Title

 

_________________________________

Date


D.        For ExceLight Communications, Inc. by:                                                                                  

 

 

 

 

 

 

 

 

 

 

 

 

 

 

_________________________________

Signed

 

Ed Miskovic _______________________

Name

 

Director of Marketing________________

Title

 

_________________________________

Date


 

E.       For Finisar Corporation by:                                                                                                            

 

 

 

 

 

 

 

 

 

 

 

 

 

 

_________________________________

Signed

 

Jerry S. Rawls_____________________

Name

 

President and Chief Executive Officer___

Title

 

_________________________________

Date


 

F.        For Fujikura Technology America Corp. by:                                                                                               

 

 

 

 

 

 

 

 

 

 

 

 

 

 

_________________________________

Signed

 

Hirokazu Hashimoto_________________

Name

 

President_________________________

Title

 

_________________________________

Date


G.       For Hitachi Cable by:                                                                                                                          

 

 

 

 

 

 

 

 

 

 

 

 

 

_________________________________

Signed

 

Lou Marra_________________________

Name

 

Engineering Manager________________

Title

 

_________________________________

Date


 

H.        For Infineon Technologies Corporation by:                                                                                

 

 

 

 

 

 

 

 

 

 

 

 

 

_________________________________

Signed

 

Schelto Van Doorn__________________

Name

 

Engineering Manager – Fiber Optics____

Title

 

_________________________________

Date


 

I.          For IBM Corporation by:                                                                                                                 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

_________________________________

Signed

 

Dale Crist_________________________

Name

 

Business Line Manager, Transport______

Title

 

_________________________________

Date


J.         For Lucent Technologies by:                                                                                                         

 

 

 

 

 

 

 

 

 

 

 

 

 

 

_________________________________

Signed

 

Margaret Acker_____________________

Name

 

Marketing Director___________________

Title

 

_________________________________­

Date


 

K.        For Molex, Inc. by:                                                                                                                          

 

 

 

 

 

 

 

 

 

 

 

 

 

_________________________________

Signed

 

Tony Dorin________________________

Name

 

Director of Marketing________________

Title

 

_________________________________

Date


 

L.         For Optical Communication Products, Inc. by:                                                                           

 

_________________________________

Signed

 

Mohammad Ghorbanali______________

Name

 

Vice President and COO_____________

Title

 

_________________________________

Date


M.        For Picolight, Inc. by:                                                                                                                     

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

_________________________________

Signed

 

Chris J. Simoneaux__________________

Name

 

Product Line Manager________________

Title

 

_________________________________

Date


 

 

N.        For Stratos Lightwave by:                                                                                                               

 

 

 

 

 

 

 

 

 

 

 

 

 

_________________________________

Signed

 

Jeff Vetter_________________________

Name

 

Director of Sales & Marketing__________

Title

 

_________________________________

Date


 

O.        For Tyco Electronics by:                                                                                                                

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

_________________________________

Signed

 

Glenn Moore_______________________

Name

 

Vice President_____________________

Title

 

_________________________________

Date

 

 

 



[1]     Bit 7 is the high order bit and is transmitted first in each byte.